Showing results: 61 - 73 of 73 items found.
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TA Instruments
The Light Flash technique provides information on a material’s ability to store and transfer heat through measurements of thermal diffusivity, thermal conductivity, and specific heat capacity. Thorough understanding of these properties is critical for any process or material which experiences a large or fast temperature gradient, or for which the tolerance for temperature change is exacting. Accurate values of these properties are essential for modeling and managing heat, whether the component of interest is called on to insulate, conduct, or simply withstand temperature changes. Information about these properties is routinely used in heat transfer models of all complexities. Heat transfer property measurements also reflect important information about material composition, purity and structure, as well as secondary performance characteristics such as tolerance to thermal shock.
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TA Instruments
Thermal conductivity defines a material’s ability to transfer heat. A precise and accurate measurement is critical for any process or material experiencing large or fast temperature gradients, or for which the tolerance for temperature changes is exacting. Accurate values are essential for modeling and managing heat, whether the component of interest is called on to insulate, conduct, or simply withstand temperature changes. Information about these properties are routinely used in heat transfer models of all complexities. Thermophysical property measurements also reflect important information about material composition, purity and structure, as well as secondary performance characteristics such as tolerance to thermal shock.
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ST60 Quad -
Dexter Research Center, Inc.
A four-channel silicon-based thermopile detector in a TO-5 package. Each small active area size is 0.61mm x 0.61mm. This is our lowest-cost and fastest time constant four-channel detector. It delivers a time constant of 18ms with Nitrogen encapsulation gas combined with a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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ST60 Dual -
Dexter Research Center, Inc.
A two-channel silicon-based thermopile detector in a TO-5 package. Each small active area size is 0.61mm x 0.61mm. This is our lowest-cost and fastest time constant two-channel detector. It delivers a time constant of 18ms with Nitrogen encapsulation gas combined with a very low Temperature Coefficient of Responsivity of -0.04%/°C. This detector has a very short thermal shock response to ambient temperature change.
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ST60 With Diffractive Lens -
Dexter Research Center, Inc.
A single-channel silicon-based thermopile with integrated diffractive lens and internal baffle that provides lowest cost solutions in a small active area of 0.61mm x 0.61mm in a TO-5 package. Time constant of 18ms with Nitrogen encapsulation gas and a 9 FOV. Delivers a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Sanwood Environmental Chambers Co ., Ltd.
Cover temperature,humidity, thermal shock with rapid temperature change rate, vibration testing. The simulation product detects whether the adaptability and characteristics of the product itself have changed under the combined conditions of temperature and humidity in the climate environment (high and low temperature operation & storage, temperature cycle, high temperature and high humidity, low temperature and low humidity, condensation experiment. etc.).
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Innovative Circuits Engineering, inc
Our Reliability Testing Services make it possible for us to work with many different customers who manufacture devices that need tests such as pressure pot, temp cycle and more.The focus of our reliability testing lab is to provide our customers with an array of services and tests that fulfill all of their reliability testing needs. Whether you need preconditioning, thermal shock, pressure pot, or many other reliability testing needs, we are happy to be of service.
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ST60 High Temperature -
Dexter Research Center, Inc.
A single-channel silicon-based thermopile that will withstand operating temperatures of 225C, with a small active area of 0.61mm x 0.61mm in a TO-5 package. The reduced height package functions as an internal aperture. Two thermistor options provide ambient package temperature measurement. Currently only available with 8-14um silicon window. Time constant of 18ms with Nitrogen encapsulation gas delivers a very low Temperature Coefficient of Responsivity of -0.4%C. This detector has a very short thermal shock response to ambient temperature change.
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Dongguan Amade Instruments Technology Co., Ltd
Lithium battery test chambers are used to simulate various extreme conditions such as crush, impact, penetration, overcharge etc the lithium ion cells and batteries are subjected to during use, transportation, storage and disposal to determine the safety performances, tests including altitude simulation test, thermal test, vibration test, shock test, external short circuit test, impact/crush test, overcharge test, discharge test etc based on UN38.3, IEC62133, UL1642 standards. Applicable to communication products, computer products, consumer electronics, automobile power supplies and so on.
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Quest Engineering Solutions
Quest has 14 environmental chambers ranging in size from 1 cubic foot to over 1,000 cubic feet, covering temperatures from below -100C to temperatures exceeding 200C. Our temperature/humidity test chambers include one of the largest walk-in chambers (15 x 10 x 8 ft) in New England, table top, high humidity, thermal shock, and high ramp rate test chambers. We can provide a wide range of temperature/humidity conditions on a variety of different product shapes and sizes, from extremely small to large products.
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Curtiss-Wright Defense Solutions
Our commercial off-the-shelf (COTS), small form factor (SFF) mission computer systems feature modular, expandable designs that pair powerful graphics and data processing capabilities with ultra-reliable mechanical robustness. The Parvus DuraCOR line of field-tested, MIL-STD qualified mission processors has been proven in the harshest C5ISR applications, performing reliably under thermal, shock, and vibration extremes. We provide application engineering services to extend base system computing functionality for these SFF systems, adding in application-specific I/O and communications cards typically with minimal NRE fees or delivery schedule impact. With pre-integrated, pre-qualified systems tailored by the factory, Parvus DuraCOR customers dramatically reduce scheduling risk and program management overhead, while maximizing use of open architecture COTS technologies. Available in ultra-small, small and standard form factors, we have solutions to meet you SWaP requirements.
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3U PMC Carrier -
PCI EmbeddedComputer Systems
This conduction cooled 3U CompactPCI single slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens carrier and PMC module enabling the board to resist high shock and vibration.
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6U PMC Carrier -
PCI EmbeddedComputer Systems
This conduction cooled 6U CompactPCI dual slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens the carrier and PMC module enabling the board to resist high shock and vibration.
